IEC/EN 60664-3

This part of IEC 60664 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in Part 1 or Part 5. -- NOTE 1 When reference is made to Part 1 or Part 5, IEC 60664-1 or IEC 60664-5 are meant. -- This standard describes the requirements and test procedures for two methods of protection: – type 1 protection improves the microenvironment of the parts under the protection; – type 2 protection is considered to be similar to solid insulation. This standard also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in Part 1. -- NOTE 2 Examples of substrates are hybrid integrated circuits and thick-film technology. -- This standard refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair. -- The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation.